According to a UDN report, Apple became the first company to sign a contract to manufacture chipsets based on TSMC’s latest 3nm process.
Although this information has not been confirmed by TSMC at this time, a source from TSMC’s supply chain said that the trial production of 3nm and 4nm chips is progressing smoothly. Furthermore, the 3nm process is on track and is aiming for a production capacity of 600,000 units annually, as well as 50,000 units monthly.
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TSMC’s 3nm process is very beneficial for Apple, as it is considering bringing its entire electronic products to using a self-designed chipset. The iPhone maker will be TSMC’s first customer for the 3nm process, and it will soon switch to M-series chips for Macs and iPads. Additionally, a new process is used for the company’s A series chips.
Similar to TSMC, Samsung has been working on 3nm process for a long time. However, the Korean tech giant uses GAA, not FinFET architecture like TSMC. Despite this, TSMC is in fact still leading, especially after signing with Apple.
If you didn’t know, TSMC has been researching and developing the 3nm process for a long time, and is expected to begin test production in the second half of 2021 – before mass production under contract. 2022. The 3nm process is the successor to the latest 5nm process, used for most of today’s high-end smartphone chipsets, including the Apple A14 Bionic chip on the latest iPhone 12 series.