Apple was the first company to sign a contract with TSMC to produce 3nm chips

According to a UDN report, Apple became the first company to sign a contract to manufacture chipsets based on TSMC’s latest 3nm process.

Although this information has not been confirmed by TSMC at this time, a source from TSMC’s supply chain said that the trial production of 3nm and 4nm chips is progressing smoothly. Furthermore, the 3nm process is on track and is aiming for a production capacity of 600,000 units annually, as well as 50,000 units monthly.

Apple was the first company to sign a contract with tsmc to produce 3nm chips 1787

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TSMC’s 3nm process is very beneficial for Apple, as it is considering bringing its entire electronic products to using a self-designed chipset. The iPhone maker will be TSMC’s first customer for the 3nm process, and it will soon switch to M-series chips for Macs and iPads. Additionally, a new process is used for the company’s A series chips.

Similar to TSMC, Samsung has been working on 3nm process for a long time. However, the Korean tech giant uses GAA, not FinFET architecture like TSMC. Despite this, TSMC is in fact still leading, especially after signing with Apple.

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If you didn’t know, TSMC has been researching and developing the 3nm process for a long time, and is expected to begin test production in the second half of 2021 – before mass production under contract. 2022. The 3nm process is the successor to the latest 5nm process, used for most of today’s high-end smartphone chipsets, including the Apple A14 Bionic chip on the latest iPhone 12 series.